Sealevel Systems, Inc. will be closed beginning December 20, 2024. Order processing and communication will resume January 2, 2025.

Custom Manufacturing

Custom Manufacturing

All product design and assembly takes place at our ISO 9001:2015 registered manufacturing facility, located in the United States of America. These processes are subject to our rigorous quality standards to meet our high-reliability guarantee for critical communications electronics.

Our state-of-the art Surface Mount Technology (SMT) line consists of an Automated Screen Printer with 2D Inspection, three High Speed SMT pick and place machines, a Ten Zone Forced Convection Reflow Oven and a 5-Camera Automated Optical Inspection system.

Following initial build, our in-house team of J-STD-001 and IPC-A-610 certified technicians completes through hole soldering.

For final assembly, Sealevel technicians follow detailed procedures for building, labeling and any required modifications.

Our facility features a dedicated “Special Projects” area that allows for enhanced physical security and is fully configurable to optimize production for OEMs.

Areas of Expertise

  • High Speed Surface Mount Technology (SMT)
  • Printed Circuit Board (PCB) Assembly
  • Through Hole Assembly
  • Board Level Assembly
  • Box Build Assembly
  • Automated Screen Printing with 2D Inspection
  • Automated Optical Inspection
  • Closed-Loop Inline Aqueous Cleaning
  • Automated Conformal Coating
  • Multi-Angle Transmissive X-Ray
  • Vibration & Thermal Screening