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COM EXPRESS MODULE STANDARD TYPE6 Intel Core i3 3217UE

  • Includes 1.6GHz Intel Core i3-3217UE dual-core processor
  • COM Express Basic with Type 6 connector layout
  • Integrated Mobile Intel QM77 Express chipset
  • Maximum 16GB DDR3 1600MHz RAM via dual 204-pin SODIMM slots
  • Integrated Gigabit Ethernet controller
  • Intel HD Graphics 4000 integrated on processor, operating at 650-1300MHz, supporting DirectX 11, OpenGL 3.1 and OCL 1.1
  • I/O interfaces can include up to 7x PCI Express X1, PCI Express X16, 2x SATA III (6Gb/s), 2x SATA II (3Gb/s), 8x USB 2.0, 4x USB 3.0, LPC bus, SMBus and I2C bus
  • Supports Microsoft Windows and Linux operating systems
  • Supports ACPI 3.0 power management with Smart Battery Support (LTC4100 and LTC1760)
  • Digital high definition audio integrated into Mobile Intel QM77 chipset with codec support on carrier board
  • Integrated watchdog timer and hardware monitors for supply voltages and CPU temperature
  • Embedded BIOS features AMI Aptio EFI with 16MB SPI flash
  • Analog VGA supported with 300MHz DAC with resolutions up to QXGA (2048x1536)
  • Three Digital Display Interfaces (DDI) supporting DisplayPort, HDMI, and DVI displays
  • Extended temperature operation from -40°C to 85°C ambient

Product Details

The IBR-i3-3217UE COM Express Type 6 module features an Intel Core i3-3217UE dual-core 1.6GHz processor and supports up to 16GB of 1600MHz DDR3 RAM. The module offers low power consumption (TDP 8W) and can operate fanless over an extended operating temperature range of -40°C to 85°C ambient, while the 2.3mm thick PCB is ideal for high vibration environments. Standard features include integrated Gigabit Ethernet controller, up to seven PCI Express X1 lanes, one PCI Express X16, two SATA III (6Gb/s) interfaces, two SATA II (3Gb/s) interfaces, eight USB 2.0 ports, four USB 3.0 ports, LPC bus, SMBus and I2C bus. The module includes three Digital Display Interfaces (DDI) for DisplayPort, HDMI or DVI displays.

Sealevel specializes in COM Express carrier boards built to your specific application requirements. Our extensive library of proven I/O circuits including serial, analog, and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application. COM Express development boards are also available to allow software development to begin immediately while the custom carrier board is designed.

Turn to Sealevel’s custom capabilities for expertise in electrical, mechanical, software, environmental stress screening, project management, and compliance & certification. Call us today to discuss the design capabilities, reliability improvements and design control advantages that a Sealevel COM Express carrier board or system design will bring to your next product.

 
  • Specifications
  • Features
  • Software & Documentation
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Specifications

  • Operating Temperature

    -40°C to 85°C (-40°F to 185°F)

  • Power Requirement

    TDP 8W

  • Storage Temperature

    -55°C to 85°C (-67°F to 185°F)

  • Family

    Relio

  • Dimensions

    4.92" (L) x 3.74" (W)

  • Humidity Range

    10-90% Relative Humidity/Non-Condensing

Features

Software & Documentation

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